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深圳盛思瑞创科技有限公司 > 新闻动态 > 德国ERNI恩尼推出新版本MicroSpeed Triple高速连接器

德国ERNI恩尼推出新版本MicroSpeed Triple高速连接器

发布时间: 2016/12/28 16:11:50 | 1003 次阅读

MicroSpeed Triple - new version for our high-speed connector family

06.05.2015

We have expanded our popular MicroSpeed high-speed connector family, introducing variants with three contact rows. The shielded connector family with 1 mm pitch enables high-speed data applications with up to 25 Gbit/s. The new connectors are ideal for next generation communication standards like Ethernet 100 Gbps (IEEE 802.3ba), Optical Internetworking Forum (OIF), USB 3.1 etc. Typical applications which will benefit from the new connectors are data communication and telecommunication, high-end computing, medical technology or industrial automation with high speed transmissions and high data volumes.

The new three-row versions with SMT terminals provide a high contact density with 3 x 25 positions in a 1.0 mm pitch. The center (third) row of contacts allows the user even greater flexibility for signal/shielding pin assignment. Differential pairs or single-ended signals can be assigned horizontally or vertically, depending on the application or requirements with regard to crosstalk.

With the 180° variants the MicroSpeed Triple connectors are ideal for board-to-board connections (Mezzanine) or the board connection via Flex PCBs. Board-to-board distances of 5 mm can be realized.
Electromagnetic compatibility can be significantly improved thanks to the optimized shield concept. The connectors have minimized electromagnetic radiation and very good immunity to interference.

The robust frame design with polarized mating face and the blind-mate features are decisive aspects for use in industrial environments. The dual-beam female contact ensures safe and reliable connection in rough environments and guarantees a wipe length of 1.5 mm.

MicroSpeed connectors are delivered with pick and place pad in tape and reel packaging for fully automatic processing.

  • Data rates up to 25 Gbit/s
  • 75-pin variant
  • Pitch 1,0 mm
  • Board-to-board distance 5 mm
  • Robust blind-mate design for industrial requirements
  • Improved shielding concept for highly EMC protection
  • Impedance matched 50/100 Ω
  • SMT terminals